Solder paste printing → SPI inspection → Pick & place (high-speed for small components, flexible for large ICs) → Reflow soldering → AOI → X-Ray for BGA. Stencil thickness 0.1-0.15mm. Placement accuracy ±0.05mm for high-speed, ±0.03mm for precision.
Reflow profile (RSS for SnPb, RTS for lead-free). Peak temperature 235-250°C for SAC305. Cooling rate 2-4°C/s affects solder joint grain structure.