Connector and Electronic Component Molding Guide

Connector Molding

Connector and electronic component molding demands precision beyond standard injection molding. Tight tolerances for pin spacing, flatness for SMT mounting, and strict material requirements make this a specialized capability. Chinese factories serving the connector market are concentrated in Shenzhen, Kunshan, and Dongguan.

Critical Requirements

Key specifications: flatness within 0.1mm per 100mm for SMT connectors, pin position accuracy of +/- 0.05mm or better, no flash on pin insertion areas, high-temperature materials (LCP, PA9T, PPA, PPS) requiring mold temperatures of 120-180C, and halogen-free compliance for electronics applications.

Material Selection

LCP (Liquid Crystal Polymer) is the most common connector material - provides thin-wall flow, high temperature resistance, and dimensional stability. PA9T and PA6T are alternatives with better mechanical properties. PPA (polyphthalamide) is used for high-reliability automotive connectors. Chinese factories stock LCP grades from Solvay, Celanese, and domestic producers (Kingfa, SABIC).

Quality Control

Critical QC points: X-ray inspection for hidden pin deformation, CMM for dimensional verification, flatness gauging, SMT test board fitting, and pin retention force testing. For automotive connectors, USCAR-2 or LV-214 testing may be required.