Inspecting materials without destroying them
| Method | Detects | Surface/Subsurface | Cost |
|---|---|---|---|
| Ultrasonic (UT) | Internal voids, cracks, thickness | Subsurface | Medium |
| Magnetic Particle (MT) | Surface/near-surface cracks | Surface | Low |
| Dye Penetrant (PT) | Surface-breaking cracks | Surface | Low |
| X-Ray (RT) | Internal voids, inclusions | Through thickness | High |
| Eddy Current (ET) | Cracks, conductivity, coating | Near-surface | Medium |